JPH0334864B2 - - Google Patents

Info

Publication number
JPH0334864B2
JPH0334864B2 JP59055520A JP5552084A JPH0334864B2 JP H0334864 B2 JPH0334864 B2 JP H0334864B2 JP 59055520 A JP59055520 A JP 59055520A JP 5552084 A JP5552084 A JP 5552084A JP H0334864 B2 JPH0334864 B2 JP H0334864B2
Authority
JP
Japan
Prior art keywords
heat
cooling
circuit board
chip
top cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59055520A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60198848A (ja
Inventor
Hiroshi Kano
Motonobu Kawarada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5552084A priority Critical patent/JPS60198848A/ja
Publication of JPS60198848A publication Critical patent/JPS60198848A/ja
Publication of JPH0334864B2 publication Critical patent/JPH0334864B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP5552084A 1984-03-23 1984-03-23 半導体装置冷却構造 Granted JPS60198848A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5552084A JPS60198848A (ja) 1984-03-23 1984-03-23 半導体装置冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5552084A JPS60198848A (ja) 1984-03-23 1984-03-23 半導体装置冷却構造

Publications (2)

Publication Number Publication Date
JPS60198848A JPS60198848A (ja) 1985-10-08
JPH0334864B2 true JPH0334864B2 (en]) 1991-05-24

Family

ID=13000979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5552084A Granted JPS60198848A (ja) 1984-03-23 1984-03-23 半導体装置冷却構造

Country Status (1)

Country Link
JP (1) JPS60198848A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
US5155579A (en) * 1991-02-05 1992-10-13 Advanced Micro Devices Molded heat sink for integrated circuit package
JPH0629683A (ja) * 1992-03-31 1994-02-04 Furukawa Electric Co Ltd:The 電子機器用ヒートパイプ式放熱ユニット
KR100321810B1 (ko) * 1994-09-16 2002-06-20 타나카 시게노부 힌지형히트파이프를구비한퍼스널컴퓨터냉각장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5732613Y2 (en]) * 1976-12-31 1982-07-17
JPS5626977U (en]) * 1979-08-08 1981-03-12

Also Published As

Publication number Publication date
JPS60198848A (ja) 1985-10-08

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